High-purity tin for soldering and coating applications
High-purity tin with particle size 5-200 microns. Purity 99.9% Sn content. Excellent for soldering, coating, and alloying applications. Essential component for lead-free solder formulations.
Used in soldering materials, protective coatings, alloy production, electronic applications, and food packaging. Essential for lead-free solder formulations and corrosion-resistant coatings.
Store in dry, well-ventilated area. Protect from moisture and oxidizing agents.
Use protective equipment. Avoid inhalation of dust. Keep away from oxidizing agents.
LOW HAZARD - Metal powder with low reactivity. Standard metal handling procedures apply.
Standard metal powder regulations apply. No special permits required.
Particle size: 5-200 microns, Purity: 99.9%, Electrical conductivity: 9.17x10^6 S/m, Thermal conductivity: 67 W/mK
| Chemical Formula | Sn |
| Molecular Weight | 118.71 g/mol |
| Density | 7.31 g/cm³ |
| Melting Point | 232°C |
| Boiling Point | 2602°C |
| Detonation Velocity | N/A m/s |
| Impact Sensitivity | N/A |
| Friction Sensitivity | n/a |
| Electrostatic Sensitivity | Low |
| Water Solubility | Insoluble |
| Appearance | silvery-white powder |
| Odor | Odorless |
| Stability | stable under normal conditions |