Polvo de cobre esférico de alta pureza para aplicaciones avanzadas
Spherical copper polvo con particle size 5-100 microns. High purity 99.95% Cu content. Perfect spherical shape provides excellent flowability y uniform packing. Superior for additive manufacturing y 3D printing applications.
utilizado en additive manufacturing, 3D printing, conductive inks, thermal management systems, y high-precision electronic applications. Ideal for applications requiring excellent flowability y uniform particle distribution.
almacenar en área seca y bien ventilada. proteger de la humedad y oxidizing agents.
Use protective equipment. Avoid inhalation of dust. Keep away from oxidizing agents.
PELIGRO BAJO - Metal polvo con low reactivity. Standard metal handling procedures apply.
Standard metal polvo regulations apply. No special permits required.
Particle size: 5-100 microns, Purity: 99.95%, Electrical conductivity: 5.96x10 ^ 7 S/m, Thermal conductivity: 401 W/mK, Shape: Spherical
| Fórmula Química | Cu |
| Peso Molecular | 63.55 g/mol |
| Densidad | 8.96 g/cm³ |
| Punto de Fusión | 1085°C |
| Punto de Ebullición | 2562°C |
| Velocidad de Detonación | N/A m/s |
| Sensibilidad al Impacto | N/A |
| Sensibilidad a la Fricción | n/a |
| Sensibilidad Electrostática | Baja |
| Solubilidad en Agua | Insoluble |
| Apariencia | reddish-brown spherical powder |
| Olor | Inodoro |
| Estabilidad | stable under normal conditions |