High-purity irregular copper powder for various industrial applications
Irregular copper powder with particle size 10-200 microns. High purity 99.9% Cu content. Excellent electrical and thermal conductivity properties. Irregular shape provides good interlocking for structural applications.
Used in powder metallurgy, metal injection molding, thermal spray coatings, electrical conductors, and structural components. Ideal for applications requiring good packing density and mechanical strength.
Store in dry, well-ventilated area. Protect from moisture and oxidizing agents.
Use protective equipment. Avoid inhalation of dust. Keep away from oxidizing agents.
LOW HAZARD - Metal powder with low reactivity. Standard metal handling procedures apply.
Standard metal powder regulations apply. No special permits required.
Particle size: 10-200 microns, Purity: 99.9%, Electrical conductivity: 5.96x10^7 S/m, Thermal conductivity: 401 W/mK, Shape: Irregular
| Chemical Formula | Cu |
| Molecular Weight | 63.55 g/mol |
| Density | 8.96 g/cm³ |
| Melting Point | 1085°C |
| Boiling Point | 2562°C |
| Detonation Velocity | N/A m/s |
| Impact Sensitivity | N/A |
| Friction Sensitivity | n/a |
| Electrostatic Sensitivity | Low |
| Water Solubility | Insoluble |
| Appearance | reddish-brown irregular powder |
| Odor | Odorless |
| Stability | stable under normal conditions |